MiJing Z20 Pro BGA Reballing Fixture For iPhone X-15 Pro Max
- View all variations as list
CODE | Options | Availability | Price | ||
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RG2390
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In stock
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$3499 | |||
RG2390B
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In stock
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$650 | |||
RG2390C
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In stock
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$650 | |||
RG2390D
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In stock
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$650 | |||
RG2390E
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In stock
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$650 | |||
RG2390F
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In stock
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$650 | |||
RG2390G
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In stock
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$650 | |||
RG2390A1
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In stock
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$192 | |||
RG2390A3
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In stock
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$192 | |||
RG2390A4
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In stock
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$192 | |||
RG2390A5
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In stock
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$192 | |||
RG2390A7
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In stock
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$192 | |||
RG2390A6
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In stock
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$192 | |||
RG2390A9
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In stock
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$192 | |||
RG2390A10
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In stock
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$192 | |||
RG2390A11
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In stock
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$192 | |||
RG2390A12
|
In stock
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$192 | |||
RG2390A13
|
In stock
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$192 | |||
RG2390A14
|
In stock
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$192 | |||
RG2390A15
|
In stock
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$192 | |||
RG2390A16
|
In stock
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$192 | |||
RG2390A2
|
In stock
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$192 | |||
RG2390A8
|
In stock
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$192 |
- — 12 months warranty
- — SMS notification
- — Return and exchange
- — Different payment methods
- — Best price
MiJing Z20 Pro BGA Reballing Fixture For iPhone X-15 Pro Max
Feature:
2023 MIJING Z20 Pro middle layer reballing platform for iPhone X-15 PRO MAX. MJ Z20 Pro iPhone motherboard middle layer frame tin planting fixture with BGA reballing stencil steel mesh for iPhone X-15 Pro Max motherboard soldering repair.
Option:
1. Mijing Z20 Pro iPhone X-15 Pro Max set.
2. Mijing Z20 Pro universal base.
3. Z20 Pro X-11 Pro Max reballing platform with stencil.
4. Z20 Pro iPhone 12 series reballing platform with stencil.
5. Z20 Pro iPhone 13 series reballing platform with stencil.
6. Z20 Pro iPhone 14 series reballing platform with stencil.
7. Z20 Pro iPhone 15 series reballing platform with stencil.
Z20 Pro Features:
1. iPhone X-15 PRO MAX BGA reballing fixture tool.
2. Used for positioning and reballing iPhone X-15 Pro Max PCB BGA parts.
3. Convenient and faster for reballing BGA without any damage.
4. Offer you the best solution for iPhone X-15 Pro Max BGA reballing and repairing.
How to install:
1. Install the iPhone X-15 Pro Max main board on the platform
2. Cover the iPhone X-15 Pro Max BGA reballing stencil on mainboard
3. Evenly spread tin on the cover of the reballing stencil
4. Remove the reballing stencil cover
5. Take out the motherboard and cooperate with the hot air gun to solidify the tin point.
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